Soon-Wook Kim

An evaluation of the exposure in nadir observation of the JEM-EUSO mission

Jenni Adams, S. Ahmad, J. -N. Albert et al. · Astroparticle Physics · 2013 · 135 citations · Full text

Space Mission, Atmospheric Science, Nadir Observation +3

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 130 citations

Engineering, Integrated Circuits, Silicon On Insulator +16

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 92 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Multi-objective optimization of a double-faced type printed circuit heat exchanger

Sangmoon Lee, Kwang‐Yong Kim, Soon-Wook Kim · Applied Thermal Engineering · 2013 · 62 citations

Electrical Engineering, Heat Transfer Process, Engineering +9

Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

Soon-Wook Kim, Mikael Detalle, Lan Peng et al. · 2016 · 57 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20