Mikael Detalle

Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

Soon-Wook Kim, Mikael Detalle, Lan Peng et al. · 2016 · 58 citations

Engineering, Materials Engineering, Materials Science +15

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

P. Absil, Kristof Croes, A. Leśniewska et al. · 2017 · 51 citations · Full text

Engineering, Electrical Engineering, Optoelectronics +16

Interposer technology for high band width interconnect applications

Mikael Detalle, Antonio Manna, Joeri De Vos et al. · 2013 · 27 citations

Engineering, Computer Engineering, Electrical Engineering +17

Analysis of microbump induced stress effects in 3D stacked IC technologies

Alojz Ivankoviç, Geert Van der Plas, Victor Moroz et al. · 2012 · 18 citations

Engineering, Electrical Engineering, Materials Science +17

Active-lite interposer for 2.5 & 3D integration

Geert Hellings, Mirko Scholz, Mikael Detalle et al. · 2015 · 17 citations

Engineering, Electrical Engineering, Analog Electronics +16