N. Heylen

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 138 citations

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 130 citations

Engineering, Integrated Circuits, Silicon On Insulator +16

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 92 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Influence of absorbed water components on SiOCH low-k reliability

Yunlong Li, Ivan Ciofi, L. Carbonell et al. · Journal of Applied Physics · 2008 · 86 citations

Absorbed Water Components, Reliability Engineering, Chemisorbed Water Component +9

A Thermally Stable and High-Performance 90-nm ${\rm Al}_{2}{\rm O}_{3}\backslash{\rm Cu}$-Based 1T1R CBRAM Cell

Attilio Belmonte, Woo‐Sik Kim, Boon Teik Chan et al. · IEEE Transactions on Electron Devices · 2013 · 84 citations

Aluminium Nitride, Engineering, Vlsi Design +18