Boon Teik Chan

Implementation of templated DSA for via layer patterning at the 7nm node

Roel Gronheid, Jan Doise, Joost Bekaert et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2015 · 114 citations

Engineering, Mechanical Engineering, Computer Architecture +20

First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

S. Subramanian, M. Reza Hosseini, T. Chiarella et al. · 2020 · 109 citations

Engineering, N14 Platform, Interconnect (Integrated Circuits) +16

A Thermally Stable and High-Performance 90-nm ${\rm Al}_{2}{\rm O}_{3}\backslash{\rm Cu}$-Based 1T1R CBRAM Cell

Attilio Belmonte, Woo‐Sik Kim, Boon Teik Chan et al. · IEEE Transactions on Electron Devices · 2013 · 84 citations

Aluminium Nitride, Engineering, Vlsi Design +18

Area-Selective Atomic Layer Deposition of TiN, TiO₂, and HfO₂ on Silicon Nitride with inhibition on Amorphous Carbon

Eric C. Stevens, Yoann Tomczak, Boon Teik Chan et al. · Chemistry of Materials · 2018 · 81 citations

Hfo2 Thin Films, Engineering, Thin Film Process Technology +16

Insight into Selective Surface Reactions of Dimethylamino-trimethylsilane for Area-Selective Deposition of Metal, Nitride, and Oxide

Job Soethoudt, Yoann Tomczak, Ben Meynaerts et al. · The Journal of Physical Chemistry C · 2020 · 55 citations · Full text