Implementation of templated DSA for via layer patterning at the 7nm node

Roel Gronheid, Jan Doise, Joost Bekaert, +9

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

EngineeringMechanical EngineeringComputer ArchitecturePattern TransferComputer-aided Design +18

Sub‐5 nm Patterning by Directed Self‐Assembly of Oligo(Dimethylsiloxane) Liquid Crystal Thin Films

Koen Nickmans, Jeffrey N. Murphy, Bas de Waal, +5

Advanced Materials

EngineeringMolecular Self-assemblyLiquid Crystalline ElastomerColloidal NanocrystalsThin Film Process Technology +18

28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV lithography

Danilo De Simone, Luka Ključar, Poulomi Das, +26

Process optimization of templated DSA flows

Roel Gronheid, Joost Bekaert, Vijaya-Kumar Murugesan Kuppuswamy, +7

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Numerical AnalysisMathematical ProgrammingEngineeringMechanical EngineeringComputer-aided Design +21

Strategies for Increasing the Rate of Defect Annihilation in the Directed Self-Assembly of High-χ Block Copolymers

Jan Doise, Jai Hyun Koh, Ji Yeon Kim, +7

ACS Applied Materials & Interfaces

Implementation of surface energy modification in graphoepitaxy directed self-assembly for hole multiplication

Jan Doise, Joost Bekaert, Boon Teik Chan, +7

Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena

EngineeringBottom-up SynthesisMolecular Self-assemblyMechanical EngineeringComputer-aided Design +17

N7 logic via patterning using templated DSA: implementation aspects

Joost Bekaert, Jan Doise, Roel Gronheid, +5

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy

Joost Bekaert, Jan Doise, Vijaya-Kumar Murugesan Kuppuswamy, +5

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

EngineeringMolecular Self-assemblyMechanical EngineeringPattern TransferComputer-aided Design +19

EUV metal oxide resists: impact of the environment composition on CD during post-exposure delay

Sonia Castellanos, Peter De Schepper, M. Bhattacharya, +9

Via patterning in the 7-nm node using immersion lithography and graphoepitaxy directed self-assembly

Jan Doise, Joost Bekaert, Boon Teik Chan, +2

Journal of Micro/Nanolithography MEMS and MOEMS

EngineeringElectron-beam LithographyCylindrical Block CopolymerPattern TransferIntegrated Circuits +23