Process optimization of templated DSA flows

Abstract

Directed Self-Assembly (DSA) of Block Co-Polymers (BCP) has become an intense field of study as a potential patterning solution for future generation devices. The most critical challenges that need to be understood and controlled include pattern placement accuracy, achieving low defectivity in DSA patterns and how to make chip designs DSA-friendly. The DSA program at imec includes efforts on these three major topics. Specifically, in this paper the progress in setting up flows for templated DSA within the imec program will be discussed. A process has been implemented based on a hard mask as the template layer. In this paper primarily the impact of local pattern density and BCP film thickness on the templated DSA process are discussed. The open hole rate and the placement accuracy of BCP patterns within the template are the primary figures of merit.