Ivan Ciofi

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 145 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Impact of Wire Geometry on Interconnect <italic>RC</italic> and Circuit Delay

Ivan Ciofi, Antonino Contino, Philippe Roussel et al. · IEEE Transactions on Electron Devices · 2016 · 129 citations

Engineering, Computer Engineering, Electrical Engineering +17

Influence of absorbed water components on SiOCH low-k reliability

Yunlong Li, Ivan Ciofi, L. Carbonell et al. · Journal of Applied Physics · 2008 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 86 citations

Engineering, Electrical Engineering, Materials Engineering +17

Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions

Marleen H. van der Veen, N. Heyler, Olalla Varela Pedreira et al. · 2018 · 63 citations

Natural Sciences, Electrical Engineering, Materials Science +16