Antonino Contino

Impact of Wire Geometry on Interconnect <italic>RC</italic> and Circuit Delay

Ivan Ciofi, Antonino Contino, Philippe Roussel et al. · IEEE Transactions on Electron Devices · 2016 · 125 citations

3D Ic Architecture, Electrical Engineering, Physical Design (Electronics) +13

Modeling of Via Resistance for Advanced Technology Nodes

Ivan Ciofi, Philippe Roussel, Yves Saad et al. · IEEE Transactions on Electron Devices · 2017 · 61 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17

<i>RC</i> Benefits of Advanced Metallization Options

Ivan Ciofi, Philippe Roussel, Rogier Baert et al. · IEEE Transactions on Electron Devices · 2019 · 55 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Boosting Carrier Mobility of Synthetic Few Layer Graphene on SiO₂ by Interlayer Rotation and Decoupling

Xiangyu Wu, Y. F. Chuang, Antonino Contino et al. · Advanced Materials Interfaces · 2018 · 24 citations

Nanosheet, Engineering, Interlayer Rotation +17

Doping of graphene for the application in nano-interconnect

Xiangyu Wu, Inge Asselberghs, Maria Politou et al. · Microelectronic Engineering · 2016 · 13 citations

Materials Science, Graphene Nanomeshes, Engineering +5