3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor, +10

EngineeringMechanical EngineeringExtreme Wafer ThinningIntegrated CircuitsInterconnect (Integrated Circuits) +17

Au-Free AlGaN/GaN Power Diode on 8-in Si Substrate With Gated Edge Termination

Silvia Lenci, Brice De Jaeger, L. Carbonell, +6

IEEE Electron Device Letters

Wide-bandgap SemiconductorElectrical EngineeringElectronic DevicesEngineeringGated Edge Termination +12

Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Caroline M. Whelan, Michael Kinsella, L. Carbonell, +2

Microelectronic Engineering

Materials ScienceCorrosion ProtectionEngineeringSelf-assembled MonolayersCorrosion +5

Influence of absorbed water components on SiOCH low-k reliability

Yunlong Li, Ivan Ciofi, L. Carbonell, +6

Journal of Applied Physics

Absorbed Water ComponentsReliability EngineeringChemisorbed Water ComponentEngineeringEnvironmental Engineering +7

A thermal stability study of alkane and aromatic thiolate self-assembled monolayers on copper surfaces

L. Carbonell, Caroline M. Whelan, Michael Kinsella, +1

Superlattices and Microstructures

Materials ScienceEngineeringSurface FunctionalizationSurface ChemistryNanotechnology +7

Growth of ZnSe layers on β(2×4)As, (i×3)Te, and (4×2)Ga-terminated (001)GaAs substrates

L. Carbonell, V. H. Etgens, A. Koëbel, +2

Journal of Crystal Growth

SemiconductorsMaterials ScienceElectrical EngineeringIi-vi SemiconductorEngineering +7

Characterisation and integration feasibility of JSR’s low-k dielectric LKD-5109

Abhishek Das, Tetsuro Kokubo, Yoshiaki Furukawa, +20

Microelectronic Engineering

Electrical EngineeringEngineeringApplied PhysicsMicrowave EngineeringIntegration Feasibility +1

Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications

Johan Swerts, Silvia Armini, L. Carbonell, +13

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

EngineeringThin Film Process TechnologyChemical DepositionAtomic LayerRu Thin Films +14

Bulk Properties of MOCVD-Deposited HfO[sub 2] Layers for High k Dielectric Applications

Sven Van Elshocht, Mikhaı̈l R. Baklanov, Bert Brijs, +16

Journal of The Electrochemical Society

Organic PrecursorThin Film PhysicsEngineeringBulk PropertiesThin Film Process Technology +20

Chemical ordering of epitaxial FePd deposited on ZnSe and the surfactant effect of segregated Se

C. Bourgognon, S. Tatarenko, J. Cibért, +6

Applied Physics Letters

EngineeringChemistryChemical OrderingMagnetoresistanceMagnetism +22