Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi, +34

IEEE Journal of Solid-State Circuits

EngineeringVlsi Design3-D Chip StacksComputer ArchitectureDesign Issues +15

Improvement of AlGaN∕GaN high electron mobility transistor structures by <i>in situ</i> deposition of a Si3N4 surface layer

Joff Derluyn, Steven Boeykens, Kai Cheng, +7

Journal of Applied Physics

Materials ScienceSi3n4 Surface LayerElectrical EngineeringSemiconductor TechnologyEngineering +13

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &amp;amp;#x003BC;m pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor, +10

EngineeringMechanical EngineeringExtreme Wafer ThinningIntegrated CircuitsInterconnect (Integrated Circuits) +17

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti, +27

EngineeringSilicon ViasOscillator TopologiesIntegrated CircuitsInterconnect (Integrated Circuits) +16

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

Riet Labie, Wouter Ruythooren, Jan Van Humbeeck

Intermetallics

Materials ScienceNi–sn Diffusion CouplesEngineeringDiffusion ResistanceApplied Physics +5

The role of Al on Ohmic contact formation on n-type GaN and AlGaN∕GaN

Benny Van Daele, G. Van Tendeloo, Wouter Ruythooren, +3

Applied Physics Letters

Materials ScienceMaterials EngineeringMetallization SchemeWide-bandgap SemiconductorEngineering +11

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

Ole Lühn, Chris Van Hoof, Wouter Ruythooren, +1

Electrochimica Acta

Materials ScienceChemical EngineeringEngineeringMicrofabricationAspect Ratio +3

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren, +7

EngineeringDevice IntegrationComputer ArchitectureBiomedical EngineeringMicro-electromechanical System +14

Electrodeposition for the synthesis of microsystems

Wouter Ruythooren, K. Attenborough, Steven Beerten, +6

Journal of Micromechanics and Microengineering

Materials ScienceElectrometallurgyElectrical EngineeringHigh ResolutionEngineering +12

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen, +7

Microelectronic Engineering

Materials ScienceMaterials Engineering3D Ic ArchitectureEngineeringFabrication Technique +4