Wouter Ruythooren

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Improvement of AlGaN∕GaN high electron mobility transistor structures by <i>in situ</i> deposition of a Si3N4 surface layer

Joff Derluyn, Steven Boeykens, Kai Cheng et al. · Journal of Applied Physics · 2005 · 201 citations

Materials Science, Si3n4 Surface Layer, Electrical Engineering +15

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &amp;amp;#x003BC;m pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 190 citations

Engineering, Mechanical Engineering, Extreme Wafer Thinning +19

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

Riet Labie, Wouter Ruythooren, Jan Van Humbeeck · Intermetallics · 2006 · 133 citations

Materials Science, Ni–sn Diffusion Couples, Engineering +7