Riet Labie

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 137 citations

Engineering, Materials Engineering, Materials Science +9

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

Riet Labie, Wouter Ruythooren, Jan Van Humbeeck · Intermetallics · 2006 · 134 citations

Engineering, Materials Engineering, Materials Science +17

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Chukwudi Okoro, Kris Vanstreels, Riet Labie et al. · Journal of Micromechanics and Microengineering · 2010 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Rahul Agarwal, Wenqi Zhang, Paresh Limaye et al. · 2010 · 96 citations

Engineering, Materials Engineering, Materials Science +15