Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

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Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

Natural Sciences, Materials Engineering, Materials Science +10

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +14

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

A.J. Sunwoo, J. W. Morris, George K. Lucey · Metallurgical Transactions A · 1992 · 176 citations

Natural Sciences, Materials Engineering, Materials Science +12

The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys

P. J. Kay, C.A. MacKay · Transactions of the IMF · 1976 · 149 citations

Natural Sciences, Materials Engineering, Materials Science +17