Ingrid De Wolf

Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits

Ingrid De Wolf · Semiconductor Science and Technology · 1996 · 957 citations

Engineering, Mechanical Engineering, Integrated Circuits +18

Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment

Ingrid De Wolf, H.E. Maes, Stephen Jones · Journal of Applied Physics · 1996 · 348 citations

Engineering, Mechanical Engineering, Planar Stress +22

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches

W. Merlijn van Spengen, Robert Puers, R. Mertens et al. · Journal of Micromechanics and Microengineering · 2004 · 245 citations

Engineering, Radio Frequency, Power Electronics +16

A physical model to predict stiction in MEMS

W. Merlijn van Spengen, Robert Puers, Ingrid De Wolf · Journal of Micromechanics and Microengineering · 2002 · 196 citations

Engineering, Mechanical Engineering, Wetting +20