Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira, +7

Microelectronics Reliability

Electrical EngineeringEngineeringLiquid Metal CoolingEnergy EfficiencyTransport Phenomena +6

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz, +19

EngineeringStress Aware DesignMechanical EngineeringSilicon ViasComputational Mechanics +20

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Chukwudi Okoro, Kris Vanstreels, Riet Labie, +4

Journal of Micromechanics and Microengineering

EngineeringSevere Plastic DeformationMechanical EngineeringHardnessStructural Materials +22

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

Chukwudi Okoro, June W. Lau, Fardad Golshany, +2

IEEE Transactions on Electron Devices

Electrical ResistanceEngineeringCu Tsv ReliabilityMechanical EngineeringDaisy Chains +18

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Chukwudi Okoro, Riet Labie, Kris Vanstreels, +6

Journal of Materials Science

Materials ScienceMaterials EngineeringChemical EngineeringMetal ProcessingEngineering +8

Extraction of the Appropriate Material Property for Realistic Modeling of Through-Silicon-Vias using μ-Raman Spectroscopy

Chukwudi Okoro, Bart Vandevelde, Bart Swinnen, +3

EngineeringIntegrated Circuitsμ-Raman SpectroscopyRealistic ModelingSilicon On Insulator +16

Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture

Chukwudi Okoro, Mario González, Bart Vandevelde, +5

EngineeringMechanical EngineeringSilicon On InsulatorThermo-compression BondingAdvanced Packaging (Semiconductors) +18

Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Chukwudi Okoro, Cedric Huyghebaert, J. Van Olmen, +8

AIP conference proceedings

EngineeringMechanical EngineeringNon‐deformed BeolComputer-aided DesignVolume Parameterization +24

Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies

Bart Vandevelde, Chukwudi Okoro, Mario González, +2

EngineeringIc Packaging TechnologiesMechanical EngineeringComputer-aided DesignWafer Scale Processing +17

Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction

Chukwudi Okoro, Lyle E. Levine, Ruqing Xu, +2

IEEE Transactions on Electron Devices

Finfet KozEngineeringSevere Plastic DeformationCu TsvsResidual Stress +17