Chukwudi Okoro

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 135 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +8

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz et al. · 2010 · 119 citations

Engineering, Stress Aware Design, Mechanical Engineering +22

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Chukwudi Okoro, Kris Vanstreels, Riet Labie et al. · Journal of Micromechanics and Microengineering · 2010 · 108 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +24

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

Chukwudi Okoro, June W. Lau, Fardad Golshany et al. · IEEE Transactions on Electron Devices · 2014 · 101 citations

Electrical Resistance, Engineering, Cu Tsv Reliability +20

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Chukwudi Okoro, Riet Labie, Kris Vanstreels et al. · Journal of Materials Science · 2011 · 75 citations

Materials Science, Materials Engineering, Chemical Engineering +10