Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu - Concepedia

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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

75

Citations

23

References

2011

Year

Chukwudi Okoro, Riet Labie, Kris Vanstreels, Alexis Franquet, Mario González, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Bert Verlinden

Journal of Materials Science

Materials ScienceMaterials EngineeringChemical EngineeringMetal ProcessingEngineeringElectrodeposition ChemistryCorrosionMicrostructureMetallurgical InteractionMetallurgical ProcessCermetElectrochemistryThermo-mechanical Response

References

	Year	Citations

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