Concepedia

Mario González

MG

Statistics

Publications

72

Citations

2.7K

H-Index

27

Active since

1969

Affiliations

IMEC(Current)

Ghent University

Imec the Netherlands

Philips (Netherlands)

Mario González is an author at IMEC specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMicroelectronicsMechanics Of MaterialsElectrical EngineeringApplied PhysicsSolid Mechanics3D Printing

Publications per year

1969–2023

72

Publications

72

Design of metal interconnects for stretchable electronic circuits

Mario González, Fabrice Axisa, Mathieu Vanden Bulcke et al. · Microelectronics Reliability · 2008 · 393 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +7

Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits

Dominique Brosteaux, Fabrice Axisa, Mario González et al. · IEEE Electron Device Letters · 2007 · 239 citations

Smart Textile, Engineering, Mechanical Engineering +23

Printed circuit board technology inspired stretchable circuits

Jan Vanfleteren, Mario González, Frederick Bossuyt et al. · MRS Bulletin · 2012 · 141 citations · Full text

Engineering, Flexible Electronics, Printed Electronics +6

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario González, Paresh Limaye et al. · Microelectronics Reliability · 2006 · 120 citations

Electrical Engineering, Chip-scale Package, Engineering +10

Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization

Yung‐Yu Hsu, Mario González, Frederick Bossuyt et al. · IEEE Transactions on Electron Devices · 2011 · 100 citations

Engineering, Mechanical Engineering, Cu Rupture +18

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