Bart Vandevelde

Design of metal interconnects for stretchable electronic circuits

Mario González, Fabrice Axisa, Mathieu Vanden Bulcke et al. · Microelectronics Reliability · 2008 · 393 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +7

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 135 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +8

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario González, Paresh Limaye et al. · Microelectronics Reliability · 2006 · 120 citations

Electrical Engineering, Chip-scale Package, Engineering +10

Stress-induced large-area lift-off of crystalline Si films

Frédéric Dross, Jo Robbelein, Bart Vandevelde et al. · Applied Physics A · 2007 · 110 citations

Materials Science, Engineering, Surface Science +6