Bart Vandevelde

Design of metal interconnects for stretchable electronic circuits

Mario González, Fabrice Axisa, Mathieu Vanden Bulcke et al. · Microelectronics Reliability · 2008 · 398 citations

Engineering, Electrical Engineering, Materials Engineering +14

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 137 citations

Engineering, Materials Engineering, Materials Science +9

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario González, Paresh Limaye et al. · Microelectronics Reliability · 2006 · 120 citations

Engineering, Materials Engineering, Materials Science +14

Stress-induced large-area lift-off of crystalline Si films

Frédéric Dross, Jo Robbelein, Bart Vandevelde et al. · Applied Physics A · 2007 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +14