Concepedia

Ferenc Fodor

FF

Statistics

Publications

6

Citations

225

H-Index

6

Active since

2017

Affiliations

IMEC(Current)

Ferenc Fodor is an author at IMEC specializing in engineering, semiconductor devices, and electrical engineering.

Publications per year

2017–2023

6

Publications

6

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 96 citations

Engineering, Materials Engineering, Materials Science +17

Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects

P. Absil, Kristof Croes, A. Leśniewska et al. · 2017 · 51 citations · Full text

Engineering, Electrical Engineering, Optoelectronics +16

New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding

Joke De Messemaeker, Liesbeth Witters, Boyao Zhang et al. · 2023 · 34 citations

Engineering, Electrical Engineering, Materials Science +12

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Samuel Suhard, Koen Kennes, Pieter Bex et al. · 2021 · 18 citations

Engineering, Materials Science, Electronic Materials +12

Demonstration of a collective hybrid die-to-wafer integration

Samuel Suhard, Alain Phommahaxay, Koen Kennes et al. · 2020 · 15 citations

Engineering, Electrical Engineering, Materials Science +16

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