Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Abstract

In this paper, a collective hybrid bonding of a die to wafer integration using glass wafer is demonstrated. The key process steps such as thinning on glass, carrier preparation, CMP die population and wafer to wafer bonding are discussed. Die to wafer bonding yield of 90% is shown. Promising electrical yields of more than 80% are obtained on daisy chains (219 pads connections) on pitches ranging from 7μm to 40 μm.