Jash Patel

Back side exposure of variable size through silicon vias

T. Rowbotham, Jash Patel, Timothy T.-Y. Lam et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 26 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

Fumihiro Inoue, Anne Jourdain, Joeri De Vos et al. · 2016 · 25 citations

Engineering, Materials Engineering, Materials Science +13

Optimization of gas lift system for well performance improvement in Asmari formation: A techno-economic perspective

Hari Sreenivasan, Jash Patel, Dev Jain et al. · Petroleum Research · 2023 · 22 citations · Full text

Engineering, Petroleum Engineering, Artificial Lift +16

Optimization of end milling of Inconel 825 with coated tool: A mathematical comparison between GRA, TOPSIS and Fuzzy Logic methods

Neel Sanghvi, Dhairya Vora, Jash Patel et al. · Materials Today Proceedings · 2020 · 19 citations · Full text

Engineering, Industrial Engineering, Manufacturing Engineering +14

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Samuel Suhard, Koen Kennes, Pieter Bex et al. · 2021 · 18 citations

Engineering, Materials Science, Electronic Materials +12