Pieter Bex

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn et al. · 2018 · 45 citations

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Alain Phommahaxay, Samuel Suhard, Pieter Bex et al. · 2019 · 36 citations

Direct Assembly, Engineering, Interconnect (Integrated Circuits) +17

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

Engineering, Stacked Ic Technologies, Wafer Scale Processing +17

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Koen Kennes, Alain Phommahaxay, Alice Guerrero et al. · 2020 · 28 citations

Optical Materials, Engineering, Laser Applications +23

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman et al. · 2020 · 25 citations

Materials Science, Electrical Engineering, Friction Welding +8