Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn, +20

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Alain Phommahaxay, Samuel Suhard, Pieter Bex, +8

Direct AssemblyEngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +15

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, +11

EngineeringStacked Ic TechnologiesWafer Scale ProcessingAdvanced Packaging (Semiconductors)Stacked Ic Manufacturing +15

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Koen Kennes, Alain Phommahaxay, Alice Guerrero, +8

Optical MaterialsEngineeringLaser ApplicationsLaser MaterialCurrent Roadblocks +21

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman, +15

Materials ScienceElectrical EngineeringFriction WeldingEngineeringMechanical Engineering +6

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur, +12

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Samuel Suhard, Koen Kennes, Pieter Bex, +12

EngineeringDevice IntegrationDaisy ChainsIntegrated CircuitsInterconnect (Integrated Circuits) +15

Highly Optimized O-band Si Ring Modulators for Low-Power Hybrid CMOS-SiPho Transceivers

Yoojin Ban, Minkyu Kim, Peter De Heyn, +14

Demonstration of a collective hybrid die-to-wafer integration

Samuel Suhard, Alain Phommahaxay, Koen Kennes, +7

EngineeringDevice IntegrationMechanical EngineeringDaisy ChainsInterconnect (Integrated Circuits) +14

Acoustic modulation during laser debonding of collective hybrid bonded dies

Koen Kennes, Alain Phommahaxay, Alice Guerrero, +7

EngineeringLaser ScienceMechanical EngineeringLaser ApplicationsLaser Ablation +18