Alice Guerrero

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

Engineering, Manufacturing Engineering, Materials Science +15

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Koen Kennes, Alain Phommahaxay, Alice Guerrero et al. · 2020 · 28 citations

Engineering, Materials Engineering, Materials Science +10

Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Anne Jourdain, Alain Phommahaxay, Greet Verbinnen et al. · 2013 · 23 citations

Engineering, Manufacturing Engineering, Materials Engineering +11

The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

Alain Phommahaxay, Gerald Beyer, Iuliana Radu et al. · 2019 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material

Alain Phommahaxay, Goedele Potoms, Greet Verbinnen et al. · 2016 · 17 citations

Engineering, Electrical Engineering, Materials Science +14