Gerald Beyer

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 135 citations

Engineering, Materials Engineering, Materials Science +14

Challenges in the implementation of low-k dielectrics in the back-end of line

R.J.O.M. Hoofman, G.J.A.M. Verheijden, J. Michelon et al. · Microelectronic Engineering · 2005 · 111 citations

Engineering, Electrical Engineering, Materials Science +11

Characterization of Cu surface cleaning by hydrogen plasma

Mikhaı̈l R. Baklanov, Denis Shamiryan, Zs. Tôkei et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Two-step room temperature grain growth in electroplated copper

Sywert Brongersma, E. Richard, I. Vervoort et al. · Journal of Applied Physics · 1999 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +17

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 96 citations

Engineering, Materials Engineering, Materials Science +17