Zs. Tôkei

Capacitor-less, Long-Retention (>400s) DRAM Cell Paving the Way towards Low-Power and High-Density Monolithic 3D DRAM

Attilio Belmonte, Hyungrock Oh, Nouredine Rassoul et al. · 2020 · 194 citations

Engineering, Electrical Engineering, Materials Science +16

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 191 citations

Engineering, Materials Engineering, Materials Science +17

Challenges in the implementation of low-k dielectrics in the back-end of line

R.J.O.M. Hoofman, G.J.A.M. Verheijden, J. Michelon et al. · Microelectronic Engineering · 2005 · 111 citations

Engineering, Electrical Engineering, Materials Science +11

Characterization of Cu surface cleaning by hydrogen plasma

Mikhaı̈l R. Baklanov, Denis Shamiryan, Zs. Tôkei et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 86 citations

Engineering, Electrical Engineering, Materials Engineering +17