Vladimir Cherman

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Power Electronics · 2019 · 83 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +14

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +16

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · Applied Thermal Engineering · 2019 · 56 citations · Full text

Engineering, Mechanical Engineering, Computational Heat Transfer +13

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · Applied Thermal Engineering · 2019 · 51 citations · Full text

Architecture, Computational Engineering, Computational Heat Transfer +14