Tiwei Wei

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Power Electronics · 2019 · 79 citations · Full text

Engineering, Liquid Metal Cooling, Mechanical Engineering +18

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · Applied Thermal Engineering · 2019 · 52 citations · Full text

Liquid Jet Impingement, Model Validation, Engineering +7

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · Applied Thermal Engineering · 2019 · 46 citations · Full text

Printed Manifolds, 3D Ic Architecture, Engineering +10

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 43 citations · Full text

Engineering, Flow Control, Liquid Metal Cooling +20

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy et al. · Journal of Electronic Packaging · 2023 · 33 citations

Manifold Cooler, 3D Ic Architecture, Electrical Engineering +15