Herman Oprins

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 83 citations

Materials Science, Materials Engineering, Electrical Engineering +15

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Power Electronics · 2019 · 79 citations · Full text

Engineering, Liquid Metal Cooling, Mechanical Engineering +18

Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design

J. Das, Herman Oprins, Hangfeng Ji et al. · IEEE Transactions on Electron Devices · 2006 · 75 citations

Wide-bandgap Semiconductor, Engineering, Power Electronics +18

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Vlsi Design, Computer Architecture +16