Herman Oprins

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

Interconnect metals beyond copper: reliability challenges and opportunities

Kristof Croes, Christoph Adelmann, Christopher Wilson et al. · 2018 · 86 citations

Engineering, Electrical Engineering, Materials Engineering +17

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Power Electronics · 2019 · 83 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +14

Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design

J. Das, Herman Oprins, Hangfeng Ji et al. · IEEE Transactions on Electron Devices · 2006 · 75 citations

Engineering, Electrical Engineering, Materials Science +17

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +16