Concepedia

Wyatt Jason Moy

WJ

1

Publications

33

Citations

1

H-Index

2023

Active since

Affiliations

Purdue University West Lafayette(Current)

Wyatt Jason Moy is an author at Purdue University West Lafayette specializing in heat transfer, thermal management, and electronic packaging.

Top concepts

EngineeringHeat TransferMicroelectronicsMicrofabricationThermal ManagementThermal EngineeringElectronic PackagingElectrical EngineeringMechanical Engineering

Publications per year

2023–2023

1

Publications

1

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy et al. · Journal of Electronic Packaging · 2023 · 33 citations

Manifold Cooler, 3D Ic Architecture, Electrical Engineering +15

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