Giovanni Capuz

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

Aleksandrs Marinins, Sebastian Hänsch, Hüseyin Şar et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2022 · 52 citations · Full text

Optical Materials, Engineering, Device Integration +23

3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations

Engineering, Micromechanics, Electrical Resistance Measurement +21

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman et al. · 2020 · 25 citations

Materials Science, Electrical Engineering, Friction Welding +8

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Teng Wang, R. Daily, Giovanni Capuz et al. · 2014 · 23 citations

Engineering, Daisy Chains, Integrated Circuits +21

Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and Modeling

Pieter Bex, Teng Wang, Melina Lofrano et al. · 2017 · 13 citations

Situ Measurements, Engineering, Mechanical Engineering +24