R. Daily

3D stacking induced mechanical stress effects

Vladimir Cherman, Geert Van der Plas, Joeri De Vos et al. · 2014 · 30 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Interposer technology for high band width interconnect applications

Mikael Detalle, Antonio Manna, Joeri De Vos et al. · 2013 · 27 citations

Engineering, Vlsi Design, Device Integration +16

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Teng Wang, R. Daily, Giovanni Capuz et al. · 2014 · 23 citations

Engineering, Daisy Chains, Integrated Circuits +21

Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

Herman Oprins, Vladimir Cherman, Geert Van der Plas et al. · 2015 · 13 citations

Engineering, Test Package, Computer Architecture +22

Effects of packaging on mechanical stress in 3D-ICs

Vladimir Cherman, Melina Lofrano, Veerle Simons et al. · 2015 · 12 citations · Full text

Materials Science, Different Packaging Configurations, 3D Ic Architecture +14