Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Rongmei Chen, Melina Lofrano, Gioele Mirabelli, +12

2022 International Electron Devices Meeting (IEDM)

A14 NodeEngineeringEnergy EfficiencyComputer ArchitecturePower Electronics +16

3D stacking induced mechanical stress effects

Vladimir Cherman, Geert Van der Plas, Joeri De Vos, +12

EngineeringMechanical EngineeringComputer ArchitectureAdvanced Packaging (Semiconductors)Mechanics +17

Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

Mario González, Bart Vandevelde, Alojz Ivankoviç, +8

EngineeringCpi SensorsMechanical EngineeringChip Package InteractionResidual Stresses +16

Interconnect reliability – A study of the effect of dimensional and porosity scaling

Kristof Croes, Christopher J. Wilson, Melina Lofrano, +2

Microelectronic Engineering

ReliabilityElectrical EngineeringReliability EngineeringEngineeringAdvanced Packaging (Semiconductors) +5

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Bart Vandevelde, Alojz Ivankoviç, Bjorn Debecker, +9

Microelectronics Reliability

3D Ic ArchitectureFinite Element ModellingEngineeringChip-scale PackageAdvanced Packaging (Semiconductors) +10

Evaluation of Mechanical Stress Induced During IC Packaging

Vladimir Cherman, Melina Lofrano, Mario González, +5

EngineeringMechanical EngineeringChip Package InteractionSi ChipMechanical Stress +17

Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5μm pitch

Vladimir Cherman, Stefaan Van Huylenbroeck, Melina Lofrano, +7

3D Ic ArchitectureElectrical EngineeringCmos WafersEngineeringAdvanced Packaging (Semiconductors) +13

Study of void formation kinetics in Cu interconnects using local sense structures

Kristof Croes, Melina Lofrano, Christopher J. Wilson, +4

EngineeringVacuum DeviceTest StructureInterconnect (Integrated Circuits)Void Formation Kinetics +15

Block level and package level thermal assessment for back side power delivery network.

Melina Lofrano, Herman Oprins, Vladimir Cherman, +4

Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks

Xinyue Chang, Herman Oprins, Bjorn Vermeersch, +5