Melina Lofrano

Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Rongmei Chen, Melina Lofrano, Gioele Mirabelli et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 33 citations

A14 Node, Engineering, Energy Efficiency +18

3D stacking induced mechanical stress effects

Vladimir Cherman, Geert Van der Plas, Joeri De Vos et al. · 2014 · 30 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

Mario González, Bart Vandevelde, Alojz Ivankoviç et al. · 2012 · 28 citations

Engineering, Cpi Sensors, Mechanical Engineering +18

Interconnect reliability – A study of the effect of dimensional and porosity scaling

Kristof Croes, Christopher J. Wilson, Melina Lofrano et al. · Microelectronic Engineering · 2010 · 22 citations

Reliability, Electrical Engineering, Reliability Engineering +7

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Bart Vandevelde, Alojz Ivankoviç, Bjorn Debecker et al. · Microelectronics Reliability · 2014 · 20 citations

3D Ic Architecture, Finite Element Modelling, Engineering +12