Publication | Closed Access
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
20
Citations
8
References
2014
Year
3D Ic ArchitectureFinite Element ModellingEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)Chip On BoardChip-package InteractionComputer EngineeringComputer ArchitectureChip AttachmentComputer-aided DesignElectronic PackagingMicroelectronicsIc Packages3D Printing
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