Rongmei Chen

Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Rongmei Chen, Melina Lofrano, Gioele Mirabelli et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 38 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

Rongmei Chen, Pieter Weckx, Shairfe Muhammad Salahuddin et al. · 2020 · 34 citations · Full text

Engineering, Computer Engineering, Low-power Design +14

Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation—Part I: CNFET Transistor Optimization

Rongmei Chen, Lin Chen, Jie Liang et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2022 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

Backside Power Delivery: Game Changer and Key Enabler of Advanced Logic Scaling and New STCO Opportunities

A. Veloso, Bjorn Vermeersch, Rongmei Chen et al. · 2023 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +17

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and μ- & n- TSVs

Giuliano Sisto, Bilal Chehab, B. Genneret et al. · 2021 · 25 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17