Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo, +8

ECS Journal of Solid State Science and Technology

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Fumihiro Inoue, Harold Philipsen, Aleksandar Radisic, +6

Electrochimica Acta

Materials ScienceEpitaxial GrowthEngineeringNanoelectronicsSurface Science +10

Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

Fumihiro Inoue, Tomohiro Shimizu, Takumi Yokoyama, +7

Electrochimica Acta

Materials ScienceMaterials EngineeringEngineeringNanoporous MaterialNanoscale Chemistry +8

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn, +20

Origin of Voids at the SiO₂/SiO₂ and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance

Fuya Nagano, Fumihiro Inoue, Alain Phommahaxay, +8

ECS Journal of Solid State Science and Technology

Materials ScienceSemiconductorsSio 2EngineeringPhysics +13

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Sang‐Woo Kim, Serena Iacovo, +14

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +18

A motion control of mobile manipulator with external force

Fumihiro Inoue, T. Muralami, K. Ihnishi

IEEE/ASME Transactions on Mechatronics

Robot KinematicsMotion ControlRobot ControlEngineeringField Robotics +9

Influence of Si wafer thinning processes on (sub)surface defects

Fumihiro Inoue, Anne Jourdain, Lan Peng, +7

Applied Surface Science

Materials ScienceWafer Scale ProcessingEngineeringSurface DefectsSurface Science +4

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Alain Phommahaxay, Samuel Suhard, Pieter Bex, +8

Direct AssemblyEngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +15

Perfect Conformal Deposition of Electroless Cu for High Aspect Ratio Through-Si Vias

Fumihiro Inoue, Y. Harada, Mitsumasa Koyanagi, +5

Electrochemical and Solid-State Letters

EngineeringPerfect Conformal DepositionSilicon On InsulatorInterconnect (Integrated Circuits)Wafer Scale Processing +16