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Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

Materials ScienceMaterials EngineeringEngineeringNanoporous MaterialNanoscale ChemistryNanomaterialsNanotechnologyAu Nanoparticle CatalystSurface ScienceApplied PhysicsElectroless BarrierNanostructure SynthesisThrough-si Vias