Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

Natural Sciences, Chemistry, Materials Science +8

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 224 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +17

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 221 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Covalent Binding of Pd Catalysts to Ligating Self‐Assembled Monolayer Films for Selective Electroless Metal Deposition

Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger et al. · Journal of The Electrochemical Society · 1994 · 195 citations

Natural Sciences, Chemical Engineering, Chemistry +17

Structure of Chemically Deposited Nickel

A.W. Goldenstein, W. Rostoker, F. Schoßberger et al. · Journal of The Electrochemical Society · 1957 · 152 citations

Natural Sciences, Materials Engineering, Materials Science +11