All Affiliations
| # | Concept | H-Index | Publications | Citations |
|---|---|---|---|---|
1 | Engineering | 18 | 29 | 909 |
2 | Applied Physics | 15 | 21 | 619 |
3 | Chemical Engineering | 5 | 5 | 132 |
4 | Chemistry | 5 | 5 | 109 |
5 | Education | 1 | 1 | 14 |
Harold Philipsen
×
30
Publications
948
Citations
19
H-Index
| Year | Citations | |
|---|---|---|
2010 | 82 | |
2013 | 61 | |
2013 | 56 | |
2005 | 53 | |
2011 | 52 | |
2014 | 50 | |
3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsTemporary CarriersWafer Scale ProcessingAdvanced Packaging (Semiconductors) | 2011 | 50 |
2012 | 48 | |
2009 | 48 | |
2012 | 39 |
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