Harold Philipsen

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen et al. · Microelectronic Engineering · 2010 · 82 citations

Materials Science, Materials Engineering, 3D Ic Architecture +6

Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

Joke De Messemaeker, Olalla Varela Pedreira, Bart Vandevelde et al. · 2013 · 61 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +18

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Fumihiro Inoue, Harold Philipsen, Aleksandar Radisic et al. · Electrochimica Acta · 2013 · 56 citations

Materials Science, Epitaxial Growth, Engineering +12

Anisotropy in the wet-etching of semiconductors

John J. Kelly, Harold Philipsen · Current Opinion in Solid State and Materials Science · 2005 · 53 citations

Semiconductors, Engineering, Physics +6

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

A. Redolfi, Dimitrios Velenis, Sarasvathi Thangaraju et al. · 2011 · 52 citations

Engineering, Silicon Vias, Integrated Circuits +18