Copper plating for 3D interconnects - Concepedia

Concepedia

Publication | Closed Access

Copper plating for 3D interconnects

82

Citations

18

References

2010

Year

Aleksandar Radisic, Ole Lühn, Harold Philipsen, Zaid El-Mekki, M. Honoré, Simon Rodet, Silvia Armini, C. Drijbooms, H. Bender, Wouter Ruythooren

Microelectronic Engineering

Materials ScienceMaterials Engineering3D Ic ArchitectureEngineeringFabrication Technique3D IntegrationElectronic Packaging3D PrintingInterconnect (Integrated Circuits)

References

	Year	Citations

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