Ole Lühn

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Chukwudi Okoro, Kris Vanstreels, Riet Labie et al. · Journal of Micromechanics and Microengineering · 2010 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

Ole Lühn, Chris Van Hoof, Wouter Ruythooren et al. · Electrochimica Acta · 2008 · 100 citations

Engineering, Materials Engineering, Materials Science +10

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen et al. · Microelectronic Engineering · 2010 · 82 citations

Natural Sciences, Materials Engineering, Materials Science +8

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

Ole Lühn, Aleksandar Radisic, Philippe M. Vereecken et al. · Electrochemical and Solid-State Letters · 2009 · 52 citations

Natural Sciences, Materials Engineering, Materials Science +11

Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging

Deniz Sabuncuoglu Tezcan, Fabrice Duval, Harold Philipsen et al. · 2009 · 48 citations

Engineering, Electrical Engineering, Materials Science +16