Deniz Sabuncuoglu Tezcan

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 190 citations

Engineering, Mechanical Engineering, Extreme Wafer Thinning +19

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz et al. · 2010 · 119 citations

Engineering, Stress Aware Design, Mechanical Engineering +22

A low-cost uncooled infrared microbolometer detector in standard CMOS technology

Deniz Sabuncuoglu Tezcan, Selim Eminoglu · IEEE Transactions on Electron Devices · 2003 · 105 citations · Full text

Engineering, Cmos Chip Cost, Instrumentation Engineering +16

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren et al. · 2008 · 86 citations

Engineering, Device Integration, Computer Architecture +16

Low-cost uncooled infrared detectors in CMOS process

Selim Eminoglu, Deniz Sabuncuoglu Tezcan, M. Yusuf Tanrikulu · Sensors and Actuators A Physical · 2003 · 72 citations · Full text