Deniz Sabuncuoglu Tezcan

Author

Also Known As

D S Tezcan, D Sabuncuoglu Tezcan, D. S. Tezcan, D. Sabuncuoglu Tezcan, D.S. Tezcan, Deniz S Tezcan, Deniz S. Tezcan, Deniz Sabuncuoglu, Deniz Sabuncuoglu Tezcan, Deniz Tezcan

127

Publications

1.5K

Citations

H-Index

Concepts

All Affiliations

IMEC KU Leuven Middle East Technical University VIB-UAntwerp Center for Molecular Neurology National Institute for Subatomic Physics

About

Deniz Sabuncuoglu Tezcan is an author at IMEC specializing in engineering, microelectronics, and microfabrication.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	26	1.1K
2	Applied Physics	16	18	825
3	Biomedical Engineering	3	3	141
4	Health Sciences	1	1	11
5	Natural Sciences	1	1	25

Deniz Sabuncuoglu Tezcan

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &amp;#x003BC;m pitch through-Si vias Bart Swinnen, Wouter Ruythooren, Piet De Moor, EngineeringMechanical EngineeringExtreme Wafer ThinningIntegrated CircuitsInterconnect (Integrated Circuits)	2006	190
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance A. Mercha, Geert Van der Plas, Victor Moroz, EngineeringStress Aware DesignMechanical EngineeringSilicon ViasComputational Mechanics	2010	119
A low-cost uncooled infrared microbolometer detector in standard CMOS technology Deniz Sabuncuoglu Tezcan, Selim Eminoglu IEEE Transactions on Electron Devices EngineeringCmos Chip CostInstrumentation EngineeringSensor TechnologyMicromachines	2003	105
Through-silicon via and die stacking technologies for microsystems-integration Eric Beyne, Piet De Moor, Wouter Ruythooren, EngineeringDevice IntegrationComputer ArchitectureBiomedical EngineeringMicro-electromechanical System	2008	86
Low-cost uncooled infrared detectors in CMOS process Selim Eminoglu, Deniz Sabuncuoglu Tezcan, M. Yusuf Tanrikulu Sensors and Actuators A Physical	2003	72
Sloped Through Wafer Vias for 3D Wafer Level Packaging Deniz Sabuncuoglu Tezcan, Nga Pham, Bivragh Majeed, EngineeringIntegrated CircuitsTechnology DieInterconnect (Integrated Circuits)Wafer Scale Processing	2007	66
3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsTemporary CarriersWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2011	50
Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging Deniz Sabuncuoglu Tezcan, Fabrice Duval, Harold Philipsen, EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Printed ElectronicsElectronic Packaging	2009	48
The RELAXd project: Development of four-side tilable photon-counting imagers Z. Vykydal, J. Visschers, Deniz Sabuncuoglu Tezcan, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment PhotonicsQuantum ScienceEngineeringPhysicsRelaxd Project	2008	41
Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sorting Koen de Wijs, Chengxun Liu, Alexandra Dusa, Lab on a Chip	2017	37

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