M. Honoré

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen et al. · Microelectronic Engineering · 2010 · 82 citations

Materials Science, Materials Engineering, 3D Ic Architecture +6

Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

Silvia Armini, Zaid El-Mekki, K. Vandersmissen et al. · Journal of The Electrochemical Society · 2010 · 38 citations

Materials Engineering, Materials Science, Chemical Engineering +13

The influence of relative humidity on the response of tin oxide gas sensors to carbon monoxide

P. Van Geloven, M. Honoré, J. Roggen et al. · Sensors and Actuators B Chemical · 1991 · 34 citations

Chemical Engineering, Environmental Monitoring, Engineering +8

Tin(IV) oxide gas sensors: thick-film versus metallo-organic based sensors

P. Van Geloven, Jens Moons, M. Honoré et al. · Sensors and Actuators · 1989 · 27 citations

Chemical Engineering, Engineering, Sensors +7

In situ infrared and electrical characterization of tin dioxide gas sensors in nitrogen/oxygen mixtures at temperatures up to 720 K

Silvia Lenaerts, M. Honoré, G. Huyberechts et al. · Sensors and Actuators B Chemical · 1994 · 23 citations

Chemical Engineering, Engineering, Sensors +12