Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics

Mikhail Krishtab, Ivo Stassen, Timothée Stassin, +6

Nature Communications

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti, +27

EngineeringSilicon ViasOscillator TopologiesIntegrated CircuitsInterconnect (Integrated Circuits) +16

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Silvia Armini, Joke De Messemaeker, Caroline M. Whelan, +2

Journal of The Electrochemical Society

EngineeringMechanical EngineeringSilica Cmp ExperimentsCeria CoatingCeramic Matrix Composite +14

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen, +7

Microelectronic Engineering

Materials ScienceMaterials Engineering3D Ic ArchitectureEngineeringFabrication Technique +4

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen, +9

Microelectronic Engineering

Materials ScienceSilicon ViaElectrical EngineeringWafer Scale ProcessingEngineering +12

Prediction of scratch generation in chemical mechanical planarization

Abhijit Chandra, Pavan Karra, Ashraf Bastawros, +4

CIRP Annals

Materials ScienceEngineeringMaterial ProcessingMechanical EngineeringScratch Generation +3

Nanoscale Indentation of Polymer and Composite Polymer−Silica Core−Shell Submicrometer Particles by Atomic Force Microscopy

Silvia Armini, Ivan U. Vakarelski, Caroline M. Whelan, +2

Langmuir

Atomic Force MicroscopyEngineeringNanoscale IndentationMechanical EngineeringNanostructured Polymer +14

Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH₂‐Derived Self‐Assembled Monolayers

Arantxa Maestre, Silvia Armini, Olivier Richard, +4

Advanced Functional Materials

EngineeringBottom‐up EngineeringSurface NanotechnologyChemistryChemical Engineering +16

Capturing Wetting States in Nanopatterned Silicon

XiuMei Xu, Guy Vereecke, Chang Chen, +13

ACS Nano

EngineeringNanostructured SurfaceWettingSuper-hydrophobic SurfaceSilicon On Insulator +15

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Fumihiro Inoue, Harold Philipsen, Aleksandar Radisic, +6

Electrochimica Acta

Materials ScienceEpitaxial GrowthEngineeringNanoelectronicsSurface Science +10