Silvia Armini

Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics

Mikhail Krishtab, Ivo Stassen, Timothée Stassin et al. · Nature Communications · 2019 · 154 citations · Full text

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Silvia Armini, Joke De Messemaeker, Caroline M. Whelan et al. · Journal of The Electrochemical Society · 2008 · 100 citations

Engineering, Mechanical Engineering, Silica Cmp Experiments +16

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen et al. · Microelectronic Engineering · 2010 · 82 citations

Materials Science, Materials Engineering, 3D Ic Architecture +6

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 77 citations

Materials Science, Silicon Via, Electrical Engineering +14