Jan Coenen

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 79 citations

Engineering, Materials Engineering, Materials Science +16

Experimental investigation and techno-economic analysis of tetramethylammonium hydroxide removal from wastewater in nano-electronics manufacturing via membrane distillation

Imtisal-e- Noor, Jan Coenen, Andrew R. Martin et al. · Journal of Membrane Science · 2019 · 53 citations · Full text

Engineering, Chemical Engineering, Environmental Engineering +17

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)

J. Van Olmen, Jan Coenen, Wim Dehaene et al. · 2009 · 40 citations

Engineering, Electrical Engineering, Microelectronics +16

Performance assessment of chemical mechanical planarization wastewater treatment in nano-electronics industries using membrane distillation

Imtisal-e− Noor, Jan Coenen, Andrew R. Martin · Separation and Purification Technology · 2019 · 36 citations · Full text

Engineering, Chemical Engineering, Environmental Engineering +17