Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration - Concepedia

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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

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References

2010

Year

J. Van Olmen, Cedric Huyghebaert, Jan Coenen, J. Van Aelst, Erik Sleeckx, A. Van Ammel, Silvia Armini, Guruprasad Katti, Jan Vaes, Wim Dehaene,

Microelectronic Engineering

Materials ScienceSilicon ViaElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)3D Ic ArchitectureApplied PhysicsIntegration ChallengesChip Attachment3D PrintingElectronic PackagingThree-dimensional Integrated Circuits3D IntegrationInterconnect (Integrated Circuits)3D-stacked Ic IntegrationMicroelectronics

References

	Year	Citations

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