J. Van Aelst

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 191 citations

Engineering, Materials Engineering, Materials Science +17

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Computer Engineering, Electrical Engineering +17

Influence of absorbed water components on SiOCH low-k reliability

Yunlong Li, Ivan Ciofi, L. Carbonell et al. · Journal of Applied Physics · 2008 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +14

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 79 citations

Engineering, Materials Engineering, Materials Science +16

Sulphur group analysis in solid matrices by atmospheric pressure-temperature programmed reduction

Jan Yperman, I.I. Maes, H. Van den Rul et al. · Analytica Chimica Acta · 1999 · 41 citations

Natural Sciences, Chemistry, Materials Science +9