Wim Dehaene

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

Guruprasad Katti, Michele Stucchi, K. De Meyer et al. · IEEE Transactions on Electron Devices · 2009 · 579 citations

Three-dimensional Ics, Engineering, Silicon Vias +19

14.5 Envision: A 0.26-to-10TOPS/W subword-parallel dynamic-voltage-accuracy-frequency-scalable Convolutional Neural Network processor in 28nm FDSOI

Bert Moons, Roel Uytterhoeven, Wim Dehaene et al. · 2017 · 467 citations · Full text

Convolutional Neural Network, Engineering, Machine Learning +21

Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies

E. Grossar, Michele Stucchi, Karen Maex et al. · IEEE Journal of Solid-State Circuits · 2006 · 456 citations · Full text

Non-volatile Memory, Engineering, Memory Design +19

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Energy Efficiency of the IEEE 802.15.4 Standard in Dense Wireless Microsensor Networks: Modeling and Improvement Perspectives

Bruno Bougard, Francky Catthoor, Denis C. Daly et al. · Design, Automation, and Test in Europe · 2005 · 247 citations

Engineering, Wireless Sensor System, Energy Efficiency +16