Wim Dehaene

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

Guruprasad Katti, Michele Stucchi, K. De Meyer et al. · IEEE Transactions on Electron Devices · 2009 · 584 citations

Engineering, Computer Engineering, Electrical Engineering +17

14.5 Envision: A 0.26-to-10TOPS/W subword-parallel dynamic-voltage-accuracy-frequency-scalable Convolutional Neural Network processor in 28nm FDSOI

Bert Moons, Roel Uytterhoeven, Wim Dehaene et al. · 2017 · 471 citations · Full text

Computing, Computer Engineering, Computer Science +17

Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies

E. Grossar, Michele Stucchi, Karen Maex et al. · IEEE Journal of Solid-State Circuits · 2006 · 462 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

Organic RFID transponder chip with data rate compatible with electronic product coding

Kris Myny, Soeren Steudel, Steve Smout et al. · Organic Electronics · 2010 · 247 citations · Full text

Engineering, Bioengineering, Organic Chemistry +10