Low-loss amorphous silicon-on-insulator technology for photonic integrated circuitry

Shankar Kumar Selvaraja, Erik Sleeckx, Marc Schaekers, +4

Optics Communications

PhotonicsElectrical EngineeringEngineeringPhotonic Integrated CircuitryIntegrated Photonics +6

Highly efficient grating coupler between optical fiber and silicon photonic circuit

Shankar Kumar Selvaraja, Diedrik Vermeulen, Marc Schaekers, +6

PhotonicsOptical MaterialsOptical InterconnectsBragg MirrorEngineering +11

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen, +9

Microelectronic Engineering

Materials ScienceSilicon ViaElectrical EngineeringWafer Scale ProcessingEngineering +12

On the optical constants of amorphous GexSe1−x thin films of non-uniform thickness prepared by plasma-enhanced chemical vapour deposition

E. Márquez, P. Nagels, J.M. González-Leal, +3

Vacuum

Materials ScienceOptical MaterialsEngineeringOptical PropertiesPlasma-enhanced Chemical Vapour +9

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo, +8

ECS Journal of Solid State Science and Technology

Structural and optical properties of amorphous selenium prepared by plasma-enhanced CVD

P. Nagels, Erik Sleeckx, R. Callaerts, +1

Solid State Communications

Materials ScienceOptical MaterialsEngineeringOptical PropertiesAmorphous Selenium +4

Thermally and photo-induced irreversible changes in the optical properties of amorphous Ge Se100- films

Erik Sleeckx, L. Tichý, P. Nagels, +1

Journal of Non-Crystalline Solids

Performance improvement of tall triple gate devices with strained SiN layers

Nadine Collaert, A. De Keersgieter, K.G. Anil, +10

IEEE Electron Device Letters

Electrical EngineeringEngineeringVlsi DesignNarrow Fin DevicesTensile Sin Layers +9

Scaling to Sub-1 nm Equivalent Oxide Thickness with Hafnium Oxide Deposited by Atomic Layer Deposition

Annelies Delabie, Matty Caymax, Bert Brijs, +7

Journal of The Electrochemical Society

EngineeringHafnium Oxide DepositedChemical DepositionNanoelectronicsMolecular Beam Epitaxy +14

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Sang‐Woo Kim, Serena Iacovo, +14

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +18