Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen, +5

EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingNanoelectronics +16

Controlled Sulfurization Process for the Synthesis of Large Area MoS₂ Films and MoS₂/WS₂ Heterostructures

Daniele Chiappe, Inge Asselberghs, Surajit Sutar, +15

Advanced Materials Interfaces

Large AreaEngineeringTwo-dimensional MaterialsSolid-state ChemistryChemistry +15

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo, +8

ECS Journal of Solid State Science and Technology

Origin of Voids at the SiO₂/SiO₂ and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance

Fuya Nagano, Fumihiro Inoue, Alain Phommahaxay, +8

ECS Journal of Solid State Science and Technology

Materials ScienceSemiconductorsSio 2EngineeringPhysics +13

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Sang‐Woo Kim, Serena Iacovo, +14

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +18

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Alain Phommahaxay, Samuel Suhard, Pieter Bex, +8

Direct AssemblyEngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +15

Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications

Fuya Nagano, Serena Iacovo, Alain Phommahaxay, +5

ECS Journal of Solid State Science and Technology

Direct Bonding ApplicationsEngineeringFilm CharacterizationSilicon On InsulatorSilicon Carbon Nitride +15

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Koen Kennes, Alain Phommahaxay, Alice Guerrero, +8

Optical MaterialsEngineeringLaser ApplicationsLaser MaterialCurrent Roadblocks +21

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Fumihiro Inoue, Serena Iacovo, Zaid El-Mekki, +3

IEEE Electron Device Letters

EngineeringThin Film Process TechnologyChemical DepositionSurface TechnologyElectrochemical Interface +14

Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding

Fuya Nagano, Serena Iacovo, Alain Phommahaxay, +6

ECS Journal of Solid State Science and Technology

Materials ScienceMaterials EngineeringWafer-to-wafer Direct BondingWafer Scale ProcessingEngineering +13