Serena Iacovo

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 92 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Controlled Sulfurization Process for the Synthesis of Large Area MoS₂ Films and MoS₂/WS₂ Heterostructures

Daniele Chiappe, Inge Asselberghs, Surajit Sutar et al. · Advanced Materials Interfaces · 2015 · 70 citations

Large Area, Engineering, Two-dimensional Materials +17

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo et al. · ECS Journal of Solid State Science and Technology · 2019 · 68 citations · Full text

Origin of Voids at the SiO₂/SiO₂ and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance

Fuya Nagano, Fumihiro Inoue, Alain Phommahaxay et al. · ECS Journal of Solid State Science and Technology · 2023 · 44 citations · Full text

Materials Science, Semiconductors, Sio 2 +15

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Sang‐Woo Kim, Serena Iacovo et al. · 2018 · 43 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20