Joke De Messemaeker

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 130 citations

Engineering, Integrated Circuits, Silicon On Insulator +16

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Silvia Armini, Joke De Messemaeker, Caroline M. Whelan et al. · Journal of The Electrochemical Society · 2008 · 100 citations

Engineering, Mechanical Engineering, Silica Cmp Experiments +16

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska et al. · 2017 · 77 citations

Reliability Study, Engineering, Beol Interconnects +17

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Iuliana Panchenko, Kristof Croes, Ingrid De Wolf et al. · Microelectronic Engineering · 2013 · 73 citations

Materials Engineering, Materials Science, Electromigration Technique +7

Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

Joke De Messemaeker, Olalla Varela Pedreira, Bart Vandevelde et al. · 2013 · 61 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +18