Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng, +9

EngineeringIntegrated CircuitsSilicon On InsulatorInterconnect (Integrated Circuits)Wafer Scale Processing +14

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Silvia Armini, Joke De Messemaeker, Caroline M. Whelan, +2

Journal of The Electrochemical Society

EngineeringMechanical EngineeringSilica Cmp ExperimentsCeria CoatingCeramic Matrix Composite +14

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska, +11

Reliability StudyEngineeringBeol InterconnectsRu Filled LinesInterconnect (Integrated Circuits) +15

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Iuliana Panchenko, Kristof Croes, Ingrid De Wolf, +3

Microelectronic Engineering

Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringInterconnect (Integrated Circuits) +5

Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

Joke De Messemaeker, Olalla Varela Pedreira, Bart Vandevelde, +4

EngineeringSilicon On InsulatorInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +16

Correlation between Cu microstructure and TSV Cu pumping

Joke De Messemaeker, Olalla Varela Pedreira, Harold Philipsen, +4

EngineeringGrain SizeCu MicrostructureInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors) +14

Texture of IF steel after equal channel angular pressing (ECAP)

Joke De Messemaeker, Bert Verlinden, J. Van Humbeeck

Acta Materialia

Materials ScienceIf SteelEngineeringCorrosionMechanical Engineering +2

Reliability Challenges Related to TSV Integration and 3-D Stacking

Kristof Croes, Joke De Messemaeker, Yunlong Li, +6

IEEE Design and Test

EngineeringComputer ArchitectureSystem ReliabilityIntegrated CircuitsReliability Engineering +15

New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding

Joke De Messemaeker, Liesbeth Witters, Boyao Zhang, +6

On the impossibility of multi-pass equal-channel angular drawing

Jon Alkorta, Marleen Rombouts, Joke De Messemaeker, +2

Scripta Materialia

Geometric ModelingEngineeringNatural SciencesGeometric RepresentationComputer-aided Design +5