Iuliana Panchenko

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Iuliana Panchenko, Kristof Croes, Ingrid De Wolf et al. · Microelectronic Engineering · 2013 · 73 citations

Materials Engineering, Materials Science, Electromigration Technique +7

Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study

Kong Boon Yeap, Ehrenfried Zschech, Ude Hangen et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 26 citations

Materials Engineering, Materials Science, Elastic Anisotropy +13

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Catharina Rudolph, Anke Hanisch, M. Voigtlander et al. · 2021 · 22 citations

Engineering, Simulated Process Parameters, Industrial Engineering +20

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 20 citations · Full text

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration

Iuliana Panchenko, Steffen Bickel, Jörg Meyer et al. · Japanese Journal of Applied Physics · 2017 · 19 citations

Engineering, Fine-pitch Interconnects, Integrated Circuits +20