Iuliana Panchenko - Concepedia

Author

Iuliana Panchenko

Technische Universität Dresden ORCID

Also Known As

I. Panchenko, I. Y. Panchenko, Iuliana Panchenko, Juliana Panchenko, Wei-Chen Huang

Publications

401

Citations

H-Index

Concepts

All Affiliations

Technische Universität Dresden Fraunhofer Institute for Reliability and Microintegration IMEC Fraunhofer Institute for Electronic Nano Systems Fraunhofer-Gesellschaft

About

Iuliana Panchenko is an author at Technische Universität Dresden specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	217
2	Applied Physics	8	8	195
3	Natural Sciences	1	1	13
4	Chemical Engineering	1	1	13
5	Chemistry	1	1	13

Iuliana Panchenko

Publications

260

Citations

H-Index

Page 1

	Year	Citations
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects Iuliana Panchenko, Kristof Croes, Ingrid De Wolf, Microelectronic Engineering Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)	2013	73
Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study Kong Boon Yeap, Ehrenfried Zschech, Ude Hangen, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceElastic Anisotropy3D Ic ArchitectureEngineering	2011	26
Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters Catharina Rudolph, Anke Hanisch, M. Voigtlander, EngineeringSimulated Process ParametersIndustrial EngineeringDigital ManufacturingIntegrated Circuits	2021	22
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests Iuliana Panchenko, Laura Wenzel, Maik Mueller, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingDetailed Characterization	2022	20
Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration Iuliana Panchenko, Steffen Bickel, Jörg Meyer, Japanese Journal of Applied Physics EngineeringFine-pitch InterconnectsIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale Processing	2017	19
Effects of bonding pressure on quality of SLID interconnects Iuliana Panchenko, Juergen Grafe, Maik Mueller, 2012 4th Electronic System-Integration Technology Conference EngineeringSlid InterconnectsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electron Microscopy	2012	15
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking Iuliana Panchenko, Klaus-Juergen Wolter, Kristof Croes, Microelectronics Reliability Materials EngineeringMaterials Science3D Ic ArchitectureIsothermal StorageEngineering	2019	15
Grain Structure Analysis of Cu/SiO<sub>2</sub> Hybrid Bond Interconnects after Reliability Testing Iuliana Panchenko, Laura Wambera, Maik Mueller, Materials ScienceAdvanced PackagingWafer StackWafer Scale ProcessingHybrid Bonding	2020	14
Characterisation of Cu/Cu bonding using self-assembled monolayer Maria Lykova, Iuliana Panchenko, U. Künzelmann, Soldering and Surface Mount Technology EngineeringNative Copper OxideMolecular Self-assemblyChemistryChemical Engineering	2018	13
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration Maria Lykova, Iuliana Panchenko, Martin Schneider‐Ramelow, Micromachines	2023	12

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