Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study - Concepedia

Concepedia

Publication | Closed Access

Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study

26

Citations

25

References

2011

Year

Kong Boon Yeap, Ehrenfried Zschech, Ude Hangen, Thomas J. Wyrobek, Lay Wai Kong, Aditya Karmakar, Xiaopeng Xu, Iuliana Panchenko

Journal of materials research/Pratt's guide to venture capital sources

Materials EngineeringMaterials ScienceElastic Anisotropy3D Ic ArchitectureEngineeringMechanical EngineeringApplied PhysicsStressstrain AnalysisMaterial ModelingMaterial SimulationSolid MechanicsElectronic PackagingTcad Simulation StudyMechanics Of MaterialsStress ManagementAnisotropic Material

References

	Year	Citations

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